Thick film circuit board and method of manufacturing the same
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorShogo Ariyoshi
Life of this patent
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Abstract
A thick film circuit board includes a substrate, a thick film resistor on the substrate and having a trimming region and a protecting element on the substrate for protecting the thick film resistor and having a window through which the trimming region is exposed. The protecting element may be a protective coating disposed on the substrate. Alternatively, the protective element may be a protective frame extending along an external periphery of a region where the thick film resistor is located on the substrate and having a height for protecting the thick film resistor from mechanical damage.
Claims5
A thick film circuit board comprising:
- a substrate;
- a thick film resistor disposed on said substrate and having a trimming region;
- an overcoat covering all of said substrate and said thick film resistor;
- and
- a protective coating disposed on said substrate partially covering and protecting said thick film resistor and having a window through which the trimming region of said thick film resistor is exposed through said overcoat.
A method of manufacturing a thick film circuit board comprising:
- providing on a substrate a thick film resistor having a trimming region;
- depositing an overcoat over all of said substrate and said thick film resistor;
- forming a protective coating on said overcoat and having a window through which the trimming region is exposed;
- and
- trimming said thick film resistor at said trimming region.
Dependencies are inferred from the claim text.