Surface-mounted fuse device
AssigneeLittelfuse, Inc.
InventorsVladimir Blecha, Katherine M. McGuire, Andrew J. Neuhalfen, Daniel B. Onken
Life of this patent
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Abstract
A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
Claims17
A thin film surface-mount fuse, said fuse comprising two material subassemblies:
- a. the first subassembly comprising a fusible link, a supporting substrate and terminal pads with a plurality of conductive terminal pad layers, the supporting substrate having an upper surface, lower surface and opposing side surfaces, a first of the plurality of conductive terminal pad layers and the fusible link formed as a single-continuous layer and extending across the upper surface of transporting substrate, the first of the conductive terminal pad layers further extending over at least a part of the opposing side surfaces and terminating on the lower surface of the substrate;
- and,
- b. the second subassembly comprising a single protective layer which overlies the fusible link so as to provide protection from impacts and oxidation.
A thin film surface mount fuse comprising:
- a. a substrate;
- b. a fusible link and a first terminal pad layer formed as a single continuous layer disposed on the substrate, wherein the fusible link and the first terminal pad layer are made of a metal selected from a group consisting of copper, silver, nickel, titanium, aluminum and alloys thereof;
- c. a second terminal pad layer disposed on the first terminal pad layer, wherein the second terminal pad is made of the same metal as the first layer;
- d. a third terminal pad layer disposed on the second terminal pad layer, wherein the third terminal pad layer is made of nickel;
- and,
- e. a fourth terminal pad layer disposed on the third terminal pad layer, wherein the fourth terminal pad layer is made of tin.
A thin film surface-mount fuse, said fuse comprising:
- a. a substrate;
- b. a fusible link made of a first conductive metal deposited on the substrate;
- c. a second conductive metal, other than the first conductive metal, deposited on the surface of the fusible link;
- and,
- d. terminal pads electrically connected to the fusible link, the terminal Dads having a plurality of conductive layers, wherein a first of the plurality of conductive layers and the fusible link form a single continuous film and wherein a second of the plurality of conductive layers is deposited on the first of the plurality of conductive layers and consists of the same metal as the first conductive metal.
Dependencies are inferred from the claim text.