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US 5,528,076 AGranted
Leadframe having metal impregnated silicon carbide mounting area
AssigneeMotorola, Inc.
InventorJeanne S. Pavio
Life of this patent
Estimating the term…
Abstract
A leadframe (10) formed by a method including providing a preform of silicon carbide, placing the preform in a mold, injecting a liquefied metal, such as aluminum, into the mold to fill the mold and infiltrate the preform, using heat and pressure. The mold defines a mounting area (12) in which the preform is positioned, and a plurality of leads (20, 22, 28, 29).
Claims10
A leadframe for semiconductor devices comprising:
- a semiconductor device mounting area formed of a metal impregnated silicon carbide;
- and
- a plurality of electrically conductive leads substantially comprised of a metal coupled to said mounting area.
A semiconductor package comprising:
- a semiconductor device having electrical terminals;
- a leadframe including a semiconductor device mounting area with a first surface and an opposing surface, formed of a metal impregnated silicon carbide and having a coefficient of thermal expansion substantially similar to a semiconductor material and a plurality of electrically conductive leads integrally formed with said mounting area, said plurality of electrically condutuctive leads comprised substantially of a metal;
- the semiconductor device being mounted on the mounting area of the leadframe with at least some of the electrical terminals electrically connected to the plurality of electrically conductive leads;
- and
- an encapsulating material surrounding the device and the mounting area with leads and the opposing surface exposed.
2 more elements
Dependencies are inferred from the claim text.