Method and apparatus for patterning and imaging member
AssigneeTexas Instruments Incorporated
InventorWilliam E. Nelson
Life of this patent
Estimating the term…
Abstract
A device (40) for patterning an imaging member (46) is provided. The device (40) comprises a light source (42) which emits light rays (44). Light rays (44) pass through a collimator (45) to collimate the light rays (48). The light then strikes a spatial light modulator (50) which is controlled by a computer (52) to reflect the light (54). The light passes through an imaging member (56) to demagnify the pattern for striking imaging member (46). Imaging member (46) is thus patterned by changing modulator (50) by computer (52).
Claims19
A method for patterning an imaging member having an organic photoresist layer, comprising the steps of:
- emitting light from a source, said light having a short wavelength suitable to expose said organic photoresist layer on said imaging member and to render said organic photoresist layer sensitive to development;
- optically focusing said light onto an array of positionable mirror devices;
- positioning selected ones of said mirror devices in response to an electrical signal to provide a pattern reflected therefrom;
- and
- optically imaging said reflected pattern onto the imaging member to form a pattern of reacted organic photoresist in said organic photoresist layer.
A method for manufacturing a semiconductor device, comprising the steps of:
- creating a digitized model of an integrated circuit;
- programming a spatial light modulator corresponding to said model;
- optically focusing light from a light source onto said modulator;
- reflecting said light from said modulator corresponding to said model through an optical imager;
- and
- passing a photoresist coated semiconductor wafer past said optical imager to transfer said model to said wafer to form the semiconductor device.
A method for patterning an imaging member having a layer of photosensitive material comprising the steps of:
- selecting a frequency band from the group consisting of the ultraviolet, x-ray, and infrared bands;
- emitting light having a frequency within said selected frequency band from a source;
- optically focusing said light onto an array of electronically programmable mirrors;
- programming said mirrors and rotating them to an on position or an off position to provide a selected one of a plurality of patterns which may be reflected therefrom;
- and
- optically imaging said reflected pattern onto the imaging member to form a pattern of reacted photosensitive material in said layer of photosensitive material.
A method of patterning a semiconductor substrate, said method comprising the steps of:
- providing a digitized model of an integrated circuit;
- forming a layer of photoresist on a semiconductor substrate;
- emitting light from a source;
- optically focusing said light onto an array of electrostatically positionable mirror devices;
- electrostatically positioning selected ones of said mirror devices in response to an electrical signal;
- generating said electrical signal, said electrical signal dependent upon said digitized model such that the positioning of said mirror devices corresponds to said digitized model;
- and
- optically imaging said reflected pattern onto the semiconductor substrate to form a pattern of reacted photoresist in said layer of photoresist.
Dependencies are inferred from the claim text.