Combination and method for coupling a heat sink to a semiconductor device
AssigneeSGS-Microelectronics S.A.
InventorsPaolo Casati, Giuseppe Marchisi
Life of this patent
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Abstract
A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.
Claims17
A combination of an electronic semiconductor device comprising a metal plate and a plastic body encapsulating the metal plate and leaving at least a major surface of the metal plate substantially exposed, a heat sink, and fastening means effective to hold a first surface of the heat sink in heat-conduction contact with the exposed major surface of the metal plate, wherein the semiconductor device has opposite sides with undercut regions, each of the undercut regions includes a recess in the insulating body, the recess being defined by a fastening surface facing away from the exposed major surface, and the fastening means releasably engage the fastening surfaces of the undercut regions.
An electronic semiconductor device comprising:
- a heat conducting plate;
- an insulating body encapsulating the plate and leaving a major surface of the plate substantially exposed;
- a plurality of fastening regions integrally formed in the insulating body, each fastening region including a recess that exposes a portion of a surface of the plate opposite to the exposed major surface;
- a heat sink contacting the plate;
- and
- a fastening clip contacting the heat sink and having ends engaging the plate at the exposed portions of the recesses, thereby coupling the plate and insulating body to the heat sink.
A method of coupling a heat sink to an electronic semiconductor device having an insulating body encapsulating a metal plate and leaving a major surface of the plate substantially exposed, the method comprising:
- contacting the heat sink with the exposed major surface of the metal plate;
- engaging the heat sink with a fastening clip;
- and
- engaging the fastening regions of the electronic semiconductor device with plural ends of the fastening clip by extending the ends of the fastening clip into recessed portions of the insulating body and engaging exposed portions of a surface of the metal plate opposite to the exposed major surface, thereby coupling the heat sink to the electronic semiconductor device.
Dependencies are inferred from the claim text.