Semiconductor package and method with vertically extended electrode leads
AssigneeHarris Corporation
InventorVictor A. K. Temple
Life of this patent
Estimating the term…
Abstract
A package for one or more semiconductor devices has an electrically insulative and thermally conductive base on a thermally conductive support. The semiconductor devices may be enclosed in an encapsulant and are electrically contacted through leads that extend through the encapsulant.
Claims33
A package for a semiconductor device comprising:
- a base comprising a thermally conductive and electrically insulative material that has a coefficient of thermal expansion sufficiently close to that of the semiconductor device so as to reduce thermal stress in said base and the semiconductor device;
- a bottom support affixed to a first surface of said base, said bottom support thickness being sufficient to reduce mechanical stress in said base;
- a top foil having a central portion affixed to a second surface of said base opposite said first surface, said top foil having an edge portion not affixed to said base, the semiconductor device being affixed to said top foil at said central portion so as to expose an electrode of the semiconductor device;
- an electrode foil having a bottom portion affixed to the exposed electrode of the semiconductor device and an end portion extending directly from said bottom portion generally perpendicular to said second surface;
- and
- an encapsulant for enclosing the semiconductor device and said top foil, leaving exposed said edge portion of said top foil and said end portion of said electrode foil so that electrical connections may be made therewith.
A package for a semiconductor device comprising:
- a thermally conductive and electrically insulative base that has a coefficient of thermal expansion approximately that of the semiconductor device;
- a top foil having a first portion affixed to a top surface of said base, and a second portion not affixed to said base, the semiconductor device being affixed to said top foil at said first portion;
- an electrode foil having a bottom portion affixed to an electrode of the semiconductor device and an end portion extending directly from said bottom portion generally perpendicular to said top surface of said base;
- and
- an encapsulant for enclosing the semiconductor device, said electrode foil, and said top foil and leaving exposed said second portion of said top foil and said end portion of said electrode foil so that electrical connections may be made therewith.
A package for plural semiconductor devices that are electrically isolated from one another in the package, comprising an electrically insulative and thermally conductive base, an electrode foil for each of the semiconductor devices that is affixed to an electrode of, and extends directly above, its respective semiconductor device, and an encapsulant that encloses the semiconductor devices and parts of each said foil, an electrically contactable part of each said foil extending from said encapsulant above its respective semiconductor device.
A package for plural semiconductor devices that are electrically isolated from one another in the package, comprising an electrically insulative and thermally conductive base having a thickness of 15 to 100 mils, a bottom support affixed to said base having a thickness of about one half the thickness of said base, an electrode foil for each of the semiconductor devices that is affixed to an electrode of, and extends directly above, its respective semiconductor device, and an encapsulant that encloses the semiconductor devices and parts of each said foil, an electrically contactable part of each said foil extending from said encapsulant directly above its respective semiconductor device.
Dependencies are inferred from the claim text.