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AssigneeInternational Business Machines Corporation
InventorsMichael J. Balconi-Lamica, Steven G. Barbee, Tony F. Heinz, Yiping Hsiao, Leping Li, Eugene H. Ratzlaff, Justin Wai-chow Wong
Estimating the term…
A contactless method and apparatus for real-time in-situ monitoring of a chemical etching process for the etching of at least one wafer in a wet chemical etchant bath are disclosed. The method comprises the steps of providing at least two conductive electrodes in the wet chemical bath, wherein the at least two electrodes are proximate to but not in contact with the at least one wafer, and further wherein said two electrodes are positioned on the same side of the wafer; and monitoring an electrical characteristic between the at least two electrodes, wherein a prescribed change in the electrical characteristic is indicative of a prescribed condition of the etching process. Such a method and apparatus are particularly useful in a wet chemical etch station.
A contactless method for real-time in-situ monitoring of a chemical etching process during etching of at least one wafer in a wet chemical etchant bath, said method comprising the steps of:
A contactless real-time in-situ chemical etch monitor for providing an indication of a state of an etching process during etching of at least one wafer in a wet chemical etchant bath, said monitor comprising:
An etch station having contactless real-time in-situ control of an etching process during etching of at least one wafer in a wet chemical etchant bath, said etch station comprising:
Dependencies are inferred from the claim text.