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US 5,515,985 AGranted
Method of forming fine copper conductor pattern
AssigneeNEC Corporation
InventorsYoshio Ohshita, Nobuki Hosoi
Life of this patent
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Abstract
In a method of forming a fine copper conductor pattern by dry etching, radiation having a predetermined wavelength or greater is applied to the surface of a substrate in order to accelerate the desorption of a compound which is formed of an etching gas and copper in the surface of a copper layer. The fine copper conductor pattern is anisotropically formed based on the linearity of the applied radiation and ions.
Claims3
A method of forming a fine copper conductor pattern by dry etching with the use of light irradiation and a plasma, comprising the steps of:
- placing a substrate in a chamber, said substrate having a copper film;
- introducing an etching gas into said chamber;
- maintaining a pressure in said chamber;
- applying to a surface of said substrate light irradiation having a wavelength of at least 700 nm which can be absorbed by a compound which is formed of said etching gas and copper of said copper film on a surface of the copper film during dry etching of the copper film to cause electronic excitation in said compound, thereby weakening bonding strength between said compound and said surface;
- and
- generating a plasma in said chamber to start the dry etching of the copper film.
3 more elements
Dependencies are inferred from the claim text.