Integrated circuit protected against electrostatic overvoltages
AssigneeSGS-Thomson Microelectronics S.A.
InventorsMarc Gens, Jean Jimenez
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AssigneeSGS-Thomson Microelectronics S.A.
InventorsMarc Gens, Jean Jimenez
Estimating the term…
A circuit protects pads of an integrated circuit having a plurality of power supply sources against electrostatic overvoltages. Each power supply is connected between a high voltage pad and a low voltage pad. Each pad of the circuit, as well as each power supply pad, is connected to the anode of a first diode having its cathode connected to a first conductive bus, and to the cathode of a second diode having its anode connected to a second conductive bus. A unidirectional clipping device is connected by its cathode to the first bus and by its anode to the second bus.
A circuit for protecting a plurality of input/output pads of an integrated circuit associated with a plurality of power supply sources against electrostatic overvoltages, each power supply source being connected to a high voltage pad and a low voltage pad, comprising:
A protection circuit for protecting an integrated circuit having a plurality of pads including a first circuit pad, a second circuit pad, a first voltage supply pad that connects to a first voltage supply and a second voltage supply pad that connects to the first voltage supply, the protection circuit comprising:
A protection circuit for protecting an integrated circuit having a plurality of pads including a first circuit pad, a second circuit pad, a first voltage supply pad that connects to a first voltage supply, and a second voltage supply pad that connects to the first voltage supply, the protection circuit comprising:
A protection circuit for protecting an integrated circuit having a plurality of external connecting means for establishing an external connection including first circuit means for establishing an external circuit connection, second circuit means for establishing an external circuit connection, first voltage supply means for establishing first external voltage connection to a first voltage supply and second voltage supply means for establishing a second external voltage connection to the first voltage supply, the protection circuit comprising:
A protection method for protecting an integrated circuit having a first circuit pad, a first voltage supply pad that connects to a first voltage supply, and a second voltage supply pad that connects to the first voltage supply, the method including:
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00: integrated devices comprising arrangements for electrical or thermal…
For devices having insulated gate electrodes, e.g. for IGFETs or IGBTs: using diodes as protective elements
Inorganic electric semiconductor devices
Term ended 4 Aug 2014 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
Integrated circuits include various components that can be destroyed by the occurrence of overvoltages. A particular problem is the protection against electrostatic overvoltages of the terminals of integrated circuits during their final manufacturing steps or handling before mounting. These electrostatic overvoltages are, for example, caused when two pads or pins of an integrated circuit are contacted by a handling tool or the fingers of a user.
2. Discussion of the Related Art
FIG. 1A represents a conventional electrostatic protection circuit for protecting pads of an integrated circuit associated with one supply source;
FIGS. 1A and 1B, taken in conjunction, represent a conventional electrostatic protection circuit for protecting pads of integrated circuits associated with two supply sources;
FIG. 2 represents an electrostatic protection circuit for protecting integrated circuit pads according to the invention;
FIG. 2 schematically represents an electrostatic overvoltage protection circuit according to the invention for protecting an integrated circuit associated with a plurality off power supply sources. Each power supply source is applied between a high supply terminal VDD.sub.1 , VDD.sub.2, . . . and a low supply terminal VSS.sub.1, VSS.sub.2, . . . The integrated circuit also includes conventional input/output pads P1, P2, . . . The protection circuit according to the invention includes buses R1 and R2 that are respectively connected to the cathode and to the anode of a clipping device Z. Each pad P1, P2, . . . is connected to bus R1 through a forward biased diode D1 and to bus R2 through a reverse biased diode D2. In addition, according to the invention, each of the high and low power supply pads, VDD.sub.1, VDD.sub.2, . . . , VSS.sub.1, VSS.sub.2, . . . , respectively, is also connected to buses R1 and R2 through forward and reverse biased diodes D1 and D2, respectively. In the embodiment of FIG. 2, buses R1 and R2 are held floating.
Thus, according to the invention, an electrostatic pulse between any one of pads P1, P2, . . . , and any other of these pads or any one of the high or flow power supply pads, will pass through a diode D1, the clipping device Z, and a diode D2.
Accordingly, this type of protection ensures full protection against electrostatic pulses between any pair of pads of the integrated circuit.