Clamp with wafer release for semiconductor wafer processing equipment

A semiconductor processing apparatus comprising:

• a wafer support platform;
• a retractable wafer clamping mechanism for holding a wafer near an edge thereof on said wafer support platform when in a fully extended position;
• a plurality of spring release mechanisms for engaging respective surfaces of the wafer in the event the wafer adheres to said wafer clamping mechanism, the engaged spring release mechanisms causing the release of the wafer from said wafer clamping mechanism;
• and
• a plurality of activators positioned in cooperative relationship to said spring release mechanisms to cause said spring release mechanisms to retract when said wafer clamping mechanism is fully extended such that said spring release mechanisms do not contact the wafer, but wherein upon retraction of said wafer clamping mechanism from said wafer, said activators enable said spring release mechanisms to extend and engage said wafer which has adhered to said wafer clamping mechanism.

A substrate processing apparatus comprising:

• a substrate support platform;
• a retractable clamping mechanism having a holding surface for holding a substrate against said support platform when in a fully extended position, said clamping mechanism including a plurality of spring release mechanisms, each biased to apply a force to a surface of the substrate whenever said substrate adheres to said holding surface upon retraction of said clamping mechanism from said fully extended position;
• and
• a plurality of activators positioned in cooperative relationship with said spring release mechanisms to cause said spring release mechanisms to retract from engaging respective surfaces of the substrate when said retractable clamping mechanism is extended to hold the substrate against said support platform.

A clamp mechanism comprising:

• a holding surface for engaging a substrate near an edge thereof against a support platform;
• a spring release mechanism biased to engage a surface of the substrate whenever the substrate adheres to said holding surface upon retraction of said holding surface away from the substrate;
• and
• an activator positioned in cooperative relationship to said spring release mechanism to cause said spring release mechanism to retract from engaging a surface of the substrate when said holding surface is holding said substrate against the support platform.

A method of releasably clamping a substrate to a support means in a deposition processing chamber, comprising the steps of:

• positioning a substrate having a peripheral edge upon said support means for processing;
• engaging said substrate at its peripheral edge with a clamp means;
• translating said clamp means between an extended position and a retracted position wherein said substrate is securely engaged by said clamp means so as to be held against said support means in said extended position, said clamp means releasing said substrate upon being moved away from said support means in said retracted position;
• depositing a material on said substrate while said substrate is being held against said supporting means;
• and
• preventing said substrate from adhering to said clamp means when said clamp means is retracted from its extended position by releasing said substrate using a substrate releasing surface mounted to said clamp means, said substrate releasing surface being translated between an extended position and a retracted position relative to said clamp means so as to be extended as said clamp means is retracted whereupon said substrate releasing surface engages a surface of said substrate to cause it to be released from said clamp means whenever said substrate adheres thereto.