Copper-based paste containing refractory metal additions for densification control
AssigneeInternational Business Machines Corporation
InventorsLawrence D. David, Shaji Farooq, Anthony Mastreani, Srinivasa S-N. Reddy, Rao V. Vallabhaneni
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Abstract
A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials. This copper-based paste has particular applicability to the formation of vias and lines in ceramic packages wherein the vias and lines would have a composition principally of copper with additions of the refractory metal.
Claims14
A copper-based paste for ceramic substrate vias and lines comprising copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials.
A copper-based paste for ceramic substrate vias and lines comprising copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials wherein the amount of said refractory metal additive is 0.4 to 4 weight percent based on the solids content of said paste.
A copper-based paste for ceramic substrate vias and lines comprising copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic materials wherein said refractory metal additive is coated on said copper particles as an organometallic compound selected from the group consisting of W(CO).sub.6, Cr(CO).sub.6, and C.sub.5 H.sub.5 Ta(CO).sub.4.
A co-fired ceramic package comprising a ceramic substrate having co-fired vias and lines, the composition of the vias and lines comprising copper particles as the majority constituent and a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten wherein the amount of said refractory metal additive is 0.4 to 4 weight percent.
A co-fired ceramic package comprising a ceramic substrate having co-fired vias and lines, the composition of the vias and lines comprising copper particles as the majority constituent and a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten wherein said refractory metal additive is coated on said copper particles.
Dependencies are inferred from the claim text.