Process of mounting semiconductor chips in a full-width-array image
AssigneeXerox Corporation
InventorKraig A. Quinn
Life of this patent
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Abstract
A process for manufacturing semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. Before chips are tacked onto the substrate with uncured epoxy, the substrate is urged evenly against a work surface defining a concave bow. The radius of curvature of the concave bow is calculated as a function of the desired spacing between adjacent chips. When the substrate having chips tacked thereon is released form the work surface, neighboring chips have parallel adjacent surfaces of the desired spacing.
Claims5
A method of assembling a chip array having a plurality of chips spaced a distance from one another, comprising the steps of:
- providing a flexible substrate;
- urging the flexible substrate evenly against a work surface, the work surface defining a concave bow causing the flexible substrate to assume a radius of curvature;
- and
- tacking a plurality of chips onto the substrate with an adhesive, arranging the chips in a line whereby top corners of adjacent surfaces of adjacent chips contact each other.
Dependencies are inferred from the claim text.