Method for preventing bit line-to-bit line leakage in the access transistor region of an AMG EPROM

A method for fabricating an alternate-metal, virtual-ground electrically programmable read-only-memory (EPROM) on a semiconductor substrate, the substrate having an array region and a pair of access select regions arranged so that the array region is formed between and adjoins the pair of access select regions, the method comprising the steps of:

• forming a plurality of rows of spaced-apart field oxide regions in each access select region, the plurality of rows including a first row and a second row;
• forming a layer of first dielectric material over the semiconductor substrate in the access select regions and the array region;
• forming a layer of first conductive material over the layer of first dielectric material and the field oxide regions in the access select regions, and over the layer of first dielectric material in the array region;
• forming a layer of second dielectric material over the layer of first conductive material in the access select regions and the array region;
• defining a plurality of parallel, spaced-apart strips on the layer of second dielectric material that extend across the array region into both of the access select regions such that first alternating strips are formed over a field oxide region in both the first row and the second row of field oxide regions in one access select region, and such that second alternating strips are formed over a field oxide region in the second row of field oxide regions in said one access select region, each strip having an angled portion formed over the field oxide region in the second row;
• and
• etching the second dielectric material and the layer of first conductive material underlying the second dielectric material to form the plurality of parallel, spaced-apart strips.

A method for fabricating an electrically programmable read-only-memory (EPROM) on a semiconductor substrate comprising the steps of:

• forming a plurality of spaced-apart field oxide regions in the semiconductor substrate;
• forming a layer of first dielectric material over the semiconductor substrate;
• forming a layer of conductive material over the layer of first dielectric material and the field oxide regions;
• forming a layer of second dielectric material over the layer of conductive material;
• defining a plurality of unmasked, spaced-apart parallel strips, and a plurality of pairs of masked, spaced-apart parallel strips on the layer of second dielectric material, each pair of masked strips having ends which are connected together over a field oxide region;
• and
• etching away the unmasked strips of second dielectric material and the layer of conductive material underlying the unmasked strips of second dielectric material to form a plurality of pairs of spaced-apart parallel strips of second dielectric material and underlying conductive material.