Loading patent…
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMinehiro Itagaki, Kazuyuki Okano, Suzushi Kimura, Seiichi Nakatani, Yoshihiro Bessho, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura
Estimating the term…
Conductive paste for via connection of a multilayer ceramic substrate, comprising: an inorganic component which consists of 30.0 to 70.0% by weight of powder of conductive material and the remainder being one of glass powder having a softening point higher than a starting point of sintering of insulating material and crystalline glass ceramic powder having a glass transition point higher than the starting point of sintering of the insulating material; and an organics vehicle component which consists of at least organic binder and solvent.
An assembly comprising a multilayer ceramic substrate having an insulating material formed of an insulating paste comprising an insulating powder and a via connection formed of a conductive paste extending within said insulating material, said conductive paste comprising:
An assembly comprising a multilayer ceramic substrate having an insulating material formed of an insulating paste comprising an insulating powder and a via connection formed of a conductive paste extending within said insulating material, said conductive paste comprising:
Dependencies are inferred from the claim text.