Insulated-gate semiconductor field effect transistor which operates with a low gate voltage and high drain and source voltages
AssigneeFuji Electric Co., Ltd.
InventorGen Tada
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Electric Co., Ltd.
InventorGen Tada
Estimating the term…
In a low voltage drive circuit section of a semiconductor integrated circuit, the gate oxide films are approximately 250 .ANG., and a low voltage N-channel IGFET and a low voltage P-channel IGFET are operable at high speed and driven at a low voltage. In a high voltage driven circuit section, the gate oxide films are approximately 1500 .ANG., and a high voltage N-channel IGFET and a high voltage P-channel IGFET are designed to have a high breakdown voltage performance. In a low gate voltage/high voltage drive circuit section, the gate oxide films are approximately 250 .ANG., and a high voltage N-channel IGFET is driven at a low gate voltage and operable at high speed. The high voltage N-channel IGFET of the low gate voltage/high voltage drive circuit section has an offset structure including a drain diffusion layer of low concentration, such that the breakdown voltage of the drain is greatly increased.
A semiconductor integrated circuit comprising:
A semiconductor integrated circuit having a substrate and a plurality of insulated gate semiconductor field effect transistors (IGFETs), each having a gate, a drain, and a source, formed thereon, at least one of the IGFETs comprising:
Dependencies are inferred from the claim text.