Low temperature chemical vapor deposition of protective coating containing platinum
AssigneeGeneral Electric Company
InventorJohn F. Ackerman
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Abstract
A method is disclosed to deposit aluminum and platinum on substrates for improved corrosion, oxidation, and erosion protection. Low temperature chemical vapor deposition is used. A homogeneous biphase coating of aluminum and platinum may be deposited, as well as sequential layers of aluminum and platinum.
Claims10
A method to form an aluminide layer on internal and external surfaces of a metal substrate with a homogeneous biphase protective coating, said method comprising:
- depositing simultaneously aluminum and platinum to form a homogeneous biphase mixture of about 25 to 1250 microns thick on the surfaces of the metal substrate by low temperature chemical vapor deposition at a temperature up to about 600.degree. C., where said aluminum is deposited in a stoichiometric amount greater than or equal to a ten fold excess of platinum from an aluminum alkyl halide precursor, and where said platinum is deposited from a precursor selected from the group consisting of platinum beta-diketonates and dialkyl platinum dienes;
- and then heating the coated metal substrate to interdiffuse the aluminum and platinum with the metal substrate to form an aluminide layer containing trace amounts of platinum.
A method to form an aluminide layer to protect internal and external surfaces of a metal substrate with alternating layers of aluminum and platinum, said method comprising:
- (a) depositing on the surfaces of said metal substrate a layer of aluminum by low temperature chemical vapor deposition at a temperature up to about 500.degree. C., where said aluminum layer is about 0.5-200 microns thick, from an aluminum alkyl halide precursor, and deposited in a stoichiometric amount greater than or equal to a ten fold excess of platinum;
- (b) depositing on said aluminum layer, a platinum layer by low temperature chemical vapor deposition at a temperature up to about 600.degree. C., where said platinum layer is about 0.005-2.0 microns thick and is deposited from a precursor selected from the group consisting of platinum beta-diketonates and dialkyl platinum dienes;
- (c) repeating steps (a) and (b) until a total thickness of about 25-1250 microns is deposited;
- and then
- (d) heating the coated metal substrate to interdiffuse the aluminum and platinum with the metal substrate to form an aluminide layer containing trace amounts of platinum.
Dependencies are inferred from the claim text.