Programmable silicon circuit board

In a wafer-based programmable interconnection substrate for creating a programmable signal line network which is capable of interconnecting a plurality of integrated circuits associated with the substrate, first rows of first signal line segments disposed in end-to-end chains in each row on one layer of the substrate and second rows of second signal line segments disposed in end-to-end chains in each row on another layer of the substrate, programmable connection means disposed at predetermined locations of the substrate for selectively connecting at least some of the first signal line segments together, for selectively connecting at least some of the second signal line segments together, and for selectively connecting at least some of the first and second signal line segments together, the signal line connections being capable of being made after the substrate has been manufactured.

In a wafer-based interconnection substrate for providing a signal line network which is capable of interconnecting a plurality of integrated circuits associated with the substrate, the network having a plurality of signal lines, bonding pads disposed at predetermined locations along the substrate for providing specific electrical connections between integrated circuits and individual signal lines of the substrate, each of the bonding pads having programmable link means for permitting the bonding pads to be selectively connected to at least one of a plurality of the signal lines after the substrate has been manufactured, wherein the programmable link means includes a plurality of link arms extending out from each of the bonding pads to permit the bonding pads to be connected to signal lines disposed on more than one side of the bonding pads.

In a wafer-based interconnection substrate for providing a programmable signal line network which is capable of interconnecting a plurality of integrated circuits associated with the substrate a plurality of bonding pad means on the substrate for integrated circuit connection sites, each bonding pad means including a pad and short outstretched arms and the signal line segments including a plurality of segments crossing each of the arms, each bonding pad means neighboring and unconnected to several line segments, and programmable connection means disposed at the crossings of the segments and the arms for selectively connecting the bonding pad means to any of the several signal line segments after the substrate has been manufactured.

In a wafer-based interconnection substrate for providing a programmable signal line network which is capable of interconnecting a plurality of integrated circuits associated with the substrate, signal line segments disposed on a layer of the substrate, a plurality of bonding pad means on the substrate for integrated circuit connection sites, each bonding pad means neighboring several line segments, and programmable connection means disposed at predetermined locations on the substrate for selectively connecting the bonding pad means to any of the several signal line segments after the substrate has been manufactured, wherein the substrate includes two metallization layers for carrying signals, the bonding pad means includes a pad and integral arm means in each layer, and the signal line segments include a plurality of segments in each layer crossing respective arm means in the other layer, and the programmable connection means are arranged to connect segments and arms.

In a wafer-based interconnection substrate for providing a programmable signal line network which is capable of interconnecting a plurality of integrated circuits associated with the substrate, signal line segments disposed on a layer of the substrate, a plurality of bonding pad means on the substrate for integrated circuit connection sites, each bonding pad means neighboring several line segments, and programmable connection means disposed at predetermined locations on the substrate for selectively connecting the bonding pad means to any of the several signal line segments after the substrate has been manufactured, wherein the substrate includes two metallization layers for carrying signals, the bonding pad means includes a pad and a pair of oppositely outstretched arms in each layer, the signal line segments in each layer include a plurality of segments extending transverse to segments of the other layer and arranged on opposite sides of the pad for selective connection to the respective arms.