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US 5,489,805 AGranted
Slotted thermal dissipater for a semiconductor package
AssigneeIntel Corporation
InventorsDale Hackitt, Behrooz Mehr
Life of this patent
Estimating the term…
Abstract
An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.
Claims4
A heat spreader for an electronic package which has an integrated circuit within a housing and coupled to a lead frame, comprising:
- a heat spreader which has a plurality of protrusions that extend from a heat spreader body and are embedded into the housing, said heat spreader further having a plurality of conical shaped legs which extend from said body and are embedded into the housing.
An electronic package, comprising:
- a housing;
- an integrated circuit within said housing;
- a lead frame coupled to said integrated circuit;
- a heat spreader which has a plurality of protrusions that extend from a heat spreader body and are embedded into said housing, said heat spreader further having a plurality of conical shaped legs which extend from said body and are embedded into said housing, said heat spreader having a plurality of slots located adjacent to an area between said integrated circuit and said lead frame.
1 more element
Dependencies are inferred from the claim text.