US 5,478,971 AGranted

Metallic circuit board and thin film diode array and method of manufacturing the same

AssigneeSharp Kabushiki Kaisha

InventorsMasahito Gotou, Kiyoshi Okano

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Abstract

An object of the invention is to economically and easily manufacture a thin film diode of back-to-back connection type having a symmetric voltage-ampere characteristic. First conducting layers of a metallic circuit board to become a wiring and an island conductor, respectively, are electrically connected with each other via a second conducting layer. The first conducting layers are electrically isolated from each other by anodizing the second conducting layer. An anodized insulating layer is formed by oxidized parts of the first conducting layers and the oxidized second conducting layer. The not-anodized part of one of the first conducting layers becomes a wiring and the not-anodized part of the other of the first conducting layers becomes an island conductor. The island conductor is considered as a first conductor and second and third conductors are formed on the anodized insulating layer on the first conductor. Thereby, a two-terminal element of a back-to-back type is completed.

Claims7

Dependent claims

A method of manufacturing a metallic circuit board wherein at least

a wiring of a predetermined pattern,
an island conductor spaced from the wiring,
a first insulating layer covering the entire surface of the wiring, and
a second insulating layer, covering the entire surface of the island conductor,
are formed on one surface of an insulating substrate, the method comprising the steps of:
(a) forming one first conducting layer on a portion of one surface of the insulating substrate, namely the portion where the first insulating layer is to be formed, and another first conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed,
(b) forming a second conducting layer on the one surface of the insulating substrate so that at least a part of the second conducting layer contacts said respective first conducting layers, and
(c) anodizing the first and second conducting layers, by using the second conducting layers as an anode, until the second conducting layer is completely oxidized to turn the non-oxidized portion of the one first conducting layer into the wiring, the oxidized portion of the one first conducting layer and the oxidized portion of the second conducting layer covering the non-oxidized portion of the one first conducting layer into the first insulating layer covering the surface of the wiring, the non-oxidized portion of the other first conducting layer into the island conductor, and the oxidized portion of the other first conducting layer and the oxidized portion of the second conducting layer covering the non-oxidized portion of the other first conducting layer into the second insulating layer covering the surface of the island conductor.

5 more elements

A method of manufacturing a metallic circuit board wherein at least

a wiring of a predetermined pattern,
an island conductor spaced from the wiring,
a first insulating layer covering the entire surface of the wiring, and
a second insulating layer, covering the entire surface of the island conductor,
are formed on one surface of an insulating substrate, the method comprising the steps of:
(a) forming a first conducting layer on the one surface of the insulating substrate so that a part of the first conducting layer is superimposed on a portion of the one surface of the insulating substrate, namely the portion where the first insulating layer is to be formed, and on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed,
(b) forming one second conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the first insulating layer is to be formed, so as to be thicker than the first conducting layer in thickness, and forming another second conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed, so as to be thicker than the first conducting layer in thickness,
(c) anodizing the first and second conducting layers, by using the first and second conducting layers as an anode, until the portion of the first conducting layer, which is not covered by the second conducting layer, is completely oxidized to turn the non-oxidized portion of the one second conducting layer into the wiring, the oxidized portion of the one second conducting layer and the oxidized portion of the first conducting layer covering the non-oxidized portion of the one second conducting layer into the first insulating layer covering the surface of the wiring, the non-oxidized portion of the other second conducting layer into the island conductor, and the oxidized portion of the other second conducting layer and the oxidized portion of the first conducting layer covering the non-oxidized portion of the other second conducting layer into the second insulating layer covering the surface of the island conductor.

5 more elements

A method of manufacturing a thin-film diode array wherein, on one surface of an insulating substrate, there are formed

a first wiring of a predetermined pattern,
a first insulating layer covering the first wiring,
a second wiring on the first insulating layer,
an electrode, and
a diode element connected to the second wiring and the electrode, the diode element comprising:
a first terminal spaced from the first wiring, the second wiring, and the electrode,
a second insulating layer covering the first terminal,
a second terminal, a part of which is superimposed on the second wiring and the second insulating layer on the first terminal, and
a third terminal, spaced from the second terminal in order to keep electrical isolation, a part of which is superimposed on the second insulating layer on the first terminal and the electrode,
the method comprising the steps of:
(a) forming one first conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the first insulating layer is to be formed, and another first conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed;
(b) forming a second conducting layer on the one surface of the insulating substrate so that at least a part of the second conducting layer contacts said respective first conducting layers;
(c) anodizing the first and second conducting layers, by using the second conducting layer as an anode, until the second conducting layer is completely oxidized to turn the non-oxidized portion of the one first conducting layer into the first wiring, the oxidized portion of the one first conducting layer and the oxidized portion of the second conducting layer covering the non-oxidized portion of the one first conducting layer into the first insulating layer covering the surface of the first wiring, the non-oxidized portion of the other first conducting layer into the first terminal, and the oxidized portion of the other first conducting layer and the oxidized portion of the second conducting layer covering the non-oxidized portion of the other first conducting layer into the second insulating layer covering the surface of the first terminal;
(d) forming the second wiring on the first insulating layer;
(e) forming the second terminal on the one surface of the insulating substrate so that a part of the second terminal is superimposed on the second wiring and the second insulating layer on the first terminal;
(f) forming, on the one surface of the insulating substrate, the third terminal spaced from the second terminal in order to keep electrical isolation, so that a part of the third terminal is superimposed on the second insulating layer on the first terminal;
and
(g) forming the electrode on the one surface of the insulating substrate so that a part of the electrode is superimposed on the third terminal.

15 more elements

A method of manufacturing a thin-film diode array wherein, on one surface of an insulating substrate, there are formed

a first wiring of a predetermined pattern,
a first insulating layer covering the first wiring,
a second wiring on the first insulating layer,
an electrode, and
a diode element connected to the second wiring and the electrode,
the diode element comprising:
a first terminal spaced from the first wiring, the second wiring, and the electrode,
a second insulating layer covering the first terminal,
a second terminal, a part of which is superimposed on the second wiring and the second insulating layer on the first terminal, and
a third terminal, spaced from the second terminal in order to keep electrical isolation, a part of which is superimposed on the second insulating layer on the first terminal and the electrode, the method comprising the steps of:
(a) forming a first conducting layer on the one surface of the insulating substrate so that a part of the first conducting layer is superimposed on a portion of the one surface of the insulating surface, namely the portion where the first insulating layer is to be formed, and on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed;
(b) forming one second conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the first insulating layer is to be formed, having a thickness larger than that of the first conducting layer, and another second conducting layer on a portion of the one surface of the insulating substrate, namely the portion where the second insulating layer is to be formed, having a larger thickness than that of the first conducting layer;
(c) anodizing the first and second conducting layers, by using the first and second conducting layers as an anode, until the portion of the first conducting layer which is not overlaid by the second conducting layer is completely oxidized to turn the non-oxidized portion of the one second conducting layer into the first wiring, the oxidized portion of the one second conducting layer and the oxidized portion of the first conducting layer covering the non-oxidized portion of the one second conducting layer into the first insulating layer covering the surface of the first wiring, the non-oxidized portion of the other second conducting layer into the first terminal, and the oxidized portion of the other second conducting layer and the oxidized portion of the first conducting layer covering the non-oxidized portion of the other second conducting layer into the second insulating layer covering the surface of the first terminal;
(d) forming the second wiring on the first insulating layer;
(e) forming the second terminal on the one surface of the insulating substrate so that a part of the second terminal is superimposed on the second wiring and the second insulating layer on the first terminal;
(f) forming the third terminal, spaced from the second terminal in order to maintain electrical isolation, on the one surface of the insulating substrate so that a part of the third terminal is superimposed on the second insulating layer on the first terminal;
and
(g) forming the electrode on the one surface of the insulating substrate so that a part of the electrode is superimposed on the third terminal.

15 more elements

Dependencies are inferred from the claim text.