Fusion heat sink for integrated circuit

#The present invention relates to integrated circuits and, more particularly, to thermal protection systems for integrated circuits. A major objective of the present invention is to provide for thermal protection of an integrated circuit.

#Much of modern progress has been based on integrated circuits of increasing speed and integration. Along with increased speed and integration has come increased power consumption, as well as increased heat dissipation. Additionally, some applications require high-power devices that can generate considerable heat despite a low level of integration. Ideally, the dissipated heat is removed as fast as it is generated. When heat is generated faster than it is dissipated, the temperature of the integrated circuit rises. In extreme cases, the heat can damage the integrated circuit and/or surrounding components.

#The problem with handling dissipated heat is handled in part by designing circuits that generate relatively little heat for their given level of functionality. The increasing implementation of CMOS technology in very-large-scale-integration devices is due in part to its lower power requirements, and thus low heat generation. Even using such power-conserving technology, modern microprocessors consume over ten Watts. Removing the heat dissipated by such circuits can be problematic, especially where the integrated circuits are closely arranged in an enclosure with limited ventilation.

#FIG. 1 is a schematic sectional view integrated circuit system with heat sink in accordance with the present invention.

#FIG. 2 is a schematic plan view of the system FIG. 1. Heat sink fins and a motor are not shown in FIG. 2.

#FIG. 3 is a flow chart of a method in accordance with the present invention practiced with the system of FIG. 1.

#An integrated circuit system 10 comprises an integrated circuit package 12 and a heat sink assembly 14. Integrated circuit package 12 includes an integrated circuit 16, a ceramic housing 18, a multitude of upward extending pins 20, and studs 22 and 24. Integrated circuit 12 provides the data processing functionality of integrated circuit system 10. Pins 20 provide for communications between integrated circuit 16 and a host system. Housing 18 protects integrated circuit 16 and provides interfacing between integrated circuit 16 and pins 20. Studs 22 and 24 provide mechanical interfacing with heat sink assembly 14 in conjunction with nuts 26 and 28. In addition, studs 22 and 24 provide for thermal and electrical interfacing with heat sink assembly 14.

#Heat sink 14 includes an aluminum body 30, aluminum fins 32, barium nitride stud insulators 34, a fusible core 36 in a cavity 38 of body 30, and a control assembly 40. Control assembly 40 includes a printed circuit board 42, a control circuit 44, and a phase-detector 50. Detector 50 includes a motor 52, a ceramic shaft 54, and brushes 56 and 58. Ceramic shaft 54 has a rotatable conductive contact 60 which alternately makes and breaks a connection between brushes 56 and 58.

#Mechanical interfacing is provided by studs 22 and 24 which are permanently installed in ceramic housing 18. Heat sink assembly 14 is mounted on integrated circuit package 12 so that stud insulators 34 slide down over studs 22 and 24. Nuts 26 and 26 then bolt heat sink assembly 14 to integrated circuit package 12.