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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTomohide Terashima
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AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTomohide Terashima
Estimating the term…
An object of the present invention is to provide a semiconductor device which is designed so as to increase a maximum controllable current and decrease hold current without degrading its characteristic and to provide a method of manufacturing such a semiconductor device. A transistor formation region 3 and a P diffusion region 15 are selectively formed through an insulating film 4 between gate electrodes 5 on an N.sup.- epitaxial layer 2. In a transistor formation region 3, an N.sup.+ diffusion region 12 is formed on a P diffusion region 11, a P diffusion region 13 is formed on the N.sup.+ diffusion region 12, and an N.sup.+ diffusion region 14 is selectively formed on a surface of the P diffusion region 13. Then, a cathode electrode 7 is formed on the P diffusion region 13, N.sup.+ diffusion region 14 and P diffusion region 15, and an anode electrode 8 is formed on a second major surface of the P.sup.+ substrate 1. Due to a structural characteristic that an increase in current between electrodes 7 and 8 causes no latch-up phenomenon, etc., a maximum controllable current can be increased, and hold current can be decreased.
A semiconductor device comprising
A semiconductor device comprising
A semiconductor device comprising
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