Polishing apparatus
AssigneeEbara Corporation
InventorsMasayoshi Hirose, Manabu Tsujimura, Seiji Ishikawa, Norio Kimura, You Ishii
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AssigneeEbara Corporation
InventorsMasayoshi Hirose, Manabu Tsujimura, Seiji Ishikawa, Norio Kimura, You Ishii
Estimating the term…
A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
A polishing apparatus for polishing a surface of a workpiece, comprising:
A polishing apparatus for polishing a surface of a workpiece, comprising:
A polishing apparatus for polishing a surface of a workpiece, comprising:
A polishing apparatus for polishing a surface of a workpiece, comprising:
A polishing apparatus for polishing a surface of a workpiece, comprising:
Dependencies are inferred from the claim text.