Method of testing fine pitch surface mount IC packages

An electronic package, comprising:

• a housing with four outer surfaces;
• an integrated circuit within said housing;
• a lead frame coupled to said integrated circuit, said lead frame having four groups of leads each extending from a corresponding outer surface of said housing and having a first surface and an opposite second surface, said lead frame also having a first, a second, a third and a fourth outer die paddle support bar, said first outer die paddle support bar having a zero datum hole, said second outer die paddle support bar having a x datum slot and said fourth outer die paddle support bar having a y datum slot;
• and,
• four strips of first dielectric material each attached to said first surfaces of a corresponding group of leads a distance from said outer surface of said housing located approximately at a final length of said leads;
• and,
• four strips of second dielectric material each attached to said second surfaces of a corresponding group of leads a distance from said outer surface of said housing located approximately at a final length of said leads, said second dielectric material being offset from said first dielectric material along a longitudinal axis of said leads.

An electronic package, comprising:

• a housing with four outer surfaces;
• an integrated circuit within said housing;
• and,
• a lead frame coupled to said integrated circuit, said lead frame having four groups of leads each extending from a corresponding outer surface of said housing, said lead frame also having a first, a second, a third and a fourth outer die paddle support bar, said first outer die paddle support bar having a zero datum hole, said second outer die paddle support bar having a x datum slot and said fourth outer die paddle support bar having a y datum slot.

A method for testing an electronic package, comprising the steps of:

• a) providing a package which has a plurality of leads extending from an outer surface of a housing, said leads having a first surface and an opposite second surface said package further having a first dielectric strip attached to said first surface of said leads and a Second dielectric strip attached to said second surface of said leads, said strips being located a distance from said outer surface of said housing located approximately at a final length of said leads;
• b) placing a plurality of test pins into contact with said leads between said outer surface of said housing and said dielectric strip;
• and,
• c) testing said package through said test pins and said leads;
• d) cutting said leads at said dielectric strip location;
• and,
• e) removing said dielectric strip.