Solid phase conformal coating suitable for use with electronic devices

A selective call receiver, comprising:

• a circuit carrying substrate having an electronic circuit pattern formed thereon;
• receiver circuitry including at least one surface mount component having leads that are electrically coupled to the electronic circuit pattern formed on the circuit carrying substrate during a solder reflow operation;
• and
• a preformed thermoplastic coating formed into a shape substantially corresponding to that of the at least one surface mount component for fully covering and insulating the leads of the at least one surface mount component without covering or insulating areas of the circuit carrying substrate that are not proximal to the leads of the at least one surface mount component when heat is applied to the preformed thermoplastic coating subsequent to the solder reflow operation.

A selective call receiver, comprising:

• a circuit carrying substrate having an electronic circuit pattern formed thereon;
• receiver circuitry for receiving messages, wherein the receiver circuitry includes at least one surface mount component having leads that are electrically coupled to the electronic circuit pattern formed on the circuit carrying substrate during a solder reflow operation;
• a preformed thermoplastic coating formed into a shape substantially corresponding to that of the at least one surface mount component for fully covering and insulating the leads of the at least one surface mount component without covering or insulating areas of the circuit carrying substrate that are not proximal to the leads of the at least one surface mount component when heat is applied to the preformed thermoplastic coating subsequent to the solder reflow operation;
• means for indicating receipt of a message by the receiver circuitry;
• and
• display means for presenting received messages.

A method for assembling a surface mount electrical component to a circuit carrying substrate, the method comprising the steps of:

• soldering leads of the surface mount electrical component to an electronic circuit pattern formed on the circuit carrying substrate, wherein solder between the leads and the electronic circuit pattern is characterized by a first temperature range in which the solder liquefies;
• positioning a preformed thermoplastic coating over the surface mount electrical component, wherein the preformed thermoplastic coating is formed into a shape substantially corresponding to that of the surface mount electrical component, and wherein the preformed thermoplastic coating is characterized by a second, lower temperature range in which the preformed thermoplastic coating liquefies;
• and
• heating the circuit carrying substrate to which the surface mount electrical component is soldered to a temperature at which the preformed thermoplastic coating liquefies and coats the leads of the surface mount electrical component without covering areas of the circuit carrying substrate that are not proximal to the surface mount electrical component.