Semiconductor device having an alignment mark

A semiconductor device having an alignment mark which is detected by laser beam, comprising:

• a semiconductor substrate;
• a first interconnection layer provided on said semiconductor substrate;
• an interlayer insulating film provided on said semiconductor substrate so as to cover said first interconnection layer;
• and
• a second interconnection layer provided on said interlayer insulating film so that said first and second interconnection layers cross each other with said interlayer insulating film therebetween, wherein
• a surface of said second interconnection layer is provided, in a particular region where said first and second interconnection layers cross each other, with a flat portion which reflects said laser beam vertically and upwardly and a portion including a plurality of recesses which reflect said laser beam irregularly, which together form said alignment mark within the particular overlapping portion.