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US 5,475,266 AGranted
Structure for microelectronic device incorporating low resistivity straps between conductive regions
AssigneeTexas Instruments Incorporated
InventorMark S. Rodder
Life of this patent
Estimating the term…
Abstract
A microelectronic device (10) provides decreased use of bar area to form contacts between a conductive strap (24) or interconnect and subsequent levels. The conductive strap comprises a conducting layer (130) and an overlying semiconducting layer (132). Connection to subsequent levels is made generally overlying substrate conductive areas such as a gate (14) and/or a moat (16). Connection to conductive sublayer (130) is accomplished by doping an overlying semiconductor sublayer (132). Any counter-doping of substrate conductive areas is blocked by an overlying well of dopant-masking (33) or sufficiently thick semiconducting (32) material.
Claims21
A connecting structure comprising:
- a substrate;
- an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate wherein said opening has substantially vertical sidewalls of a selected height;
- a first interconnective layer formed on said insulating layer and said opening so as to make contact with said first region, said first interconnective layer comprising a top part and a bottom part, the top part being a semiconductor and the bottom part being a conductive material, said first interconnective layer having a thickness sufficient to partially fill said opening and to prevent dopants from subsequent doping operations from penetrating to said first region.
A connecting structure comprising:
- a substrate having a first region and a second region;
- a first insulating layer selectively formed on said substrate, said first insulating layer defining first and second openings over said first and second regions, said openings having substantially vertical sidewalls of a selected height;
- a first interconnective layer formed over said insulating layer and said opening so as to make contact with said first and second region, said first interconnective layer formed of a silicide-forming metal reacted with an overlying undoped silicon layer, said first interconnective layer patterned so as to define a conducting strap between said first region and a second region;
- a masking layer over said first interconnective layer, said masking layer formed to have a second selected height overlying at least said first and second openings, said masking layer patterned such that selected portions of said first interconnective layer remain exposed, said masking layer acting as a mask to subsequent doping operations by which the undoped silicon of said exposed portions are doped to render a low resistivity path to said underlying silicide-forming metal, and said second selected height of said insulating layer being sufficient to prevent dopants from penetrating the portions of said first interconnective layer which lies approximately above said first and second regions whereby counter-doping of said regions may be reduced;
- a second interconnective layer overlying said masking layer and said exposed conducting strap;
- a second insulating layer overlying selected portions of said conducting strap and said masking layer and patterned such that selected portions of said conducting strap remain exposed;
- and
- a second interconnective layer overlying said second insulating layer, and overlying and in electrical communication with said conducting strap.
5 more elements
A connecting structure comprising:
- a substrate;
- an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate;
- a first interconnective layer formed on said insulating layer and in said opening so as to make contact with said first region, said first interconnective layer comprising a top part and a bottom part, the top part being a semiconductor and the bottom part being a conductive material, said first interconnective layer deposited on the sidewalls of said opening such that a cavity is defined by said first interconnective layer within said opening;
- and
- an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask to subsequent doping operations by which the semiconductor of an exposed portion of said top part is doped to render a low resistivity path from said top part to said bottom part of said first interconnective layer, said plug acting to prevent dopants from said subsequent doping operations from penetrating to said first region.
2 more elements
A connecting structure comprising:
- a substrate;
- an insulating layer selectively formed on said substrate, said insulating layer defining an opening over a first region of said substrate;
- a conductive layer formed on said insulating layer and in said opening;
- a second insulating layer formed on said conductive layer, said second insulating layer and said conductive layer deposited on the sidewalls of said opening such that a cavity is defined within said second insulating layer;
- an insulating plug partially filling said cavity and overlying said first interconnective layer about the perimeter of said cavity, said insulating plug acting as a mask during doping operations to prevent doping of the first region of the substrate;
- and
- a conductive region formed in the second insulating layer.
4 more elements
Dependencies are inferred from the claim text.