US 5,475,255 A · Circuit die having improved substrate noise isolation

Abstract

A circuit die 100 with improved substrate noise isolation may be achieved by providing a first circuit element 102 and a second circuit element 103 on a substrate 101. The first circuit element 102 generally injects noise into the substrate 101 while the second circuit element 103 is adversely affected by noise being carried in the substrate 101. To reduce the noise interference, a noise isolation ring 104-017 may be placed around the first circuit element 102 and/or the second circuit element 103 wherein the noise isolation ring is of a conducted material. A first lead 202 is electrically connected to a first circuit element 102, a second lead 205 is electrically connected to the second circuit element 103, and a third lead 201 is electrically connected to the noise isolation ring 105, wherein the third lead 201 is electrically isolated from both the first and second leads 202 and 205.

Claims14

Dependent claims

A circuit die having improved substrate noise isolation, the circuit die comprising:

a substrate;
a first circuit element deposited on the substrate, wherein the first circuit element, when in operation, injects noise carriers into the substrate;
a second circuit element deposited on the substrate, wherein operation of the second circuit element is adversely effected by the noise carriers;
a first noise isolation ring that at least partially surrounds the first circuit element, wherein the noise isolation ring is of a conductive material;
a first lead electrically connected to the second circuit element;
a second lead electrically connected to the second circuit element;
a third lead electrically connected to the nose isolation ring, wherein the third lead is electrically isolated from the first lead and the second lead;
a second noise isolation ring that at least partially surrounds the first noise isolation ring, wherein the second noise isolation ring is of the conductive material;
and
a fourth lead electrically connected to the second noise isolation ring, wherein the fourth lead is electrically isolated from the first lead, the second lead, and the third lead.

7 more elements

A circuit die having improved substrate noise isolation, the circuit die comprising:

a substrate;
a first circuit element deposited on the substrate, wherein the first circuit element, when in operation, injects noise carriers into the substrate;
a second circuit element deposited on the substrate, wherein operation of the second circuit element is adversely effected by the noise carriers;
a first noise isolation ring that at least partially surrounds the first circuit element, wherein the noise isolation ring is of a conductive material;
a first lead electrically connected to the first circuit element;
a second lead electrically connected to the second circuit element;
a third lead electrically connected to the noise isolation ring, wherein the third lead is electrically isolated from the first lead and the second lead;
a second noise isolation ring that at least partially surrounds the second circuit element;
and
a fourth lead electrically connected to the second noise isolation ring, wherein the fourth lead is electrically isolated from the first lead, the second lead, and the third lead.

7 more elements

A circuit die having improved substrate noise isolation, the circuit die comprising:

a substrate;
a first circuit element deposited on the substrate, wherein the first circuit element, injects noise carriers into the substrate;
a second circuit element deposited on the substrate, wherein the operation of the second circuit element is adversely effected by the noise carriers;
a first noise isolation ring that at least partially surrounds the second circuit element, wherein the first noise isolation ring is of a conductive material;
a first lead connected to the first circuit element;
a second lead connected to the second circuit element;
a third lead connected to the first noise isolation ring, wherein the third lead is electrically isolated from the first lead and the second lead;
a second noise isolation ring that at least partially surrounds the first noise isolation ring, wherein the second noise isolation ring is of the conductive material;
and
a fourth lead electrically connected to the second noise isolation ring, wherein the fourth lead is electrically isolated from the first lead, the second lead, and the third lead.

7 more elements

Dependencies are inferred from the claim text.

Circuit die having improved substrate noise isolation

Life of this patent

Circuit die having improved substrate noise isolation

Life of this patent

Abstract

Claims14