Focused CPU air cooling system including high efficiency heat exchanger

A focused cooling system for a multiple processor computer system, comprising:

• a vacuum pump unit for generating a flow of pressurized coolant;
• a heat exchanger corresponding to each processor in said computer system, each one of said heat exchangers being formed of a thermally conductive material and attached to its corresponding processor, each one of said heat exchangers comprising:
• a hollow body formed of a thermally conductive material for attachment to said component;
• an internal cooling structure formed of a thermally conductive material for providing an increased surface area which is exposed to said pressurized coolant, said cooling structure being thermally attached within said hollow body, said cooling structure comprising a corrugated metal fin which occupies substantially all of the cavity within said hollow body, said corrugated metal fin being periodically lanced to provide for the passage of coolant through said corrugated metal fin;
• a coolant inlet provided through the wall of said hollow body;
• and
• a coolant outlet provided through the wall of said hollow body;
• and
• a conduit connecting said vacuum pump unit with each outlet in each one of said heat exchangers, said conduit providing a coolant pathway from said heat exchanger to said vacuum pump unit.

A heat exchanger for attachment to an electronic component which generates substantial thermal energy, the heat exchanger comprising:

• a hollow body formed of a thermally conductive material adapted to be attached to said electronic component;
• an internal cooling structure formed of a thermally conductive material for providing an increased surface area for exposure to a coolant provided to said heat exchanger, said cooling structure being thermally attached within said hollow body, said cooling structure comprising a corrugated metal fin which occupies substantially all of the cavity within said hollow body, said corrugated metal fin being periodically lanced to provide for the passage of coolant through said corrugated metal fin;
• a coolant inlet provided through the wall said hollow body;
• and
• a coolant outlet provided through the wall said hollow body;
• said inlet and said outlet being located to establish a coolant path through said hollow body which maximizes contact between said coolant and the surface area of said cooling structure.

An electronics assembly, comprising:

• at least one component which generates substantial thermal energy;
• a vacuum pump unit for generating a cooling airlow;
• a heat exchanger comprising a thermally conductive material, said heat exchanger being in thermal contact with said component, said heat exchanger comprising:
• a hollow body formed of a thermally conductive material for attachment to said component;
• an internal cooling structure formed of a thermally conductive material for providing an increased surface area which is exposed to said cooling air, said cooling structure being thermally attached within said hollow body, said cooling structure comprising a corrugated metal fin which occupies substantially all of the cavity within said hollow body, said corrugated metal fin being periodically lanced to provide for the passage of cooling air through said corrugated metal fin;
• a coolant inlet provided through the wall of said hollow body;
• and
• a coolant outlet provided through the wall of said hollow body;
• and
• a conduit having a first end which is connected with said vacuum pump unit and a second end which is connected to said coolant outlet for providing a cooling air pathway from said heat exchanger to said vacuum pump unit.

A focused cooling system for a multiple processor computer system, comprising:

• a coolant compressor unit for supplying a pressurized coolant;
• a heat exchanger corresponding to each processor in said computer system, each one of said heat exchangers being formed of a thermally conductive material and attached to its corresponding processor, each one of said heat exchangers comprising:
• a hollow body formed of a thermally conductive material for attachment to its corresponding processor;
• an internal cooling structure formed of a thermally conductive material for providing an increased surface area which is exposed to said pressurized coolant, said cooling structure being thermally attached within said hollow body, said cooling structure comprising a corrugated metal fin which occupies substantially all of the cavity within said hollow body, said corrugated metal fin being periodically lanced to provide for the passage of coolant through said corrugated metal fin;
• a coolant inlet provided through the wall of said hollow body;
• and
• a coolant outlet provided through the wall of said hollow body;
• and
• a conduit connecting said coolant compressor unit with each inlet in each one of said heat exchangers, said conduit providing said pressurized coolant to each one of said heat exchangers.