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US 5,473,199 AGranted
Semiconductor device having a body with a carrier ring connected thereto
AssigneeFujitsu Limited
InventorYoji Murakami
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor device body, a ring part, and connecting parts. The semiconductor device body includes a resin package and a plurality of leads extending outwardly from the resin package. The ring part is made of a resin and surrounds the semiconductor device body. The connecting parts are made of a resin and connect the semiconductor device body and the ring part, so that the semiconductor device body is supported by the ring part via the connecting parts.
Claims10
A semiconductor device comprising:
- a semiconductor device body including a resin package and a plurality of leads extending outwardly from the resin package;
- a ring pan made of a resin and surrounding said semiconductor device body, said ring part being of a greater thickness than said semiconductor device body;
- and
- a plurality of connecting pans made of a resin and connecting said semiconductor device body and said ring part, so that said semiconductor device body is supported by said ring pan via said connecting parts.
1 more element
Dependencies are inferred from the claim text.