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US 5,473,195 AGranted
Semiconductor integrated circuit device having parallel signal wirings variable in either width or interval
AssigneeNEC Corporation
InventorHiroki Koike
Life of this patent
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Abstract
Signal wirings are incorporated in a semiconductor integrated circuit device for propagating a multi-bit signal from an array of pads to input buffer circuits, and either wiring gap or wiring width is changed for canceling difference in time constant due to the different wiring lengths so that the component bits of the multi-bit signal concurrently arrive at the input buffer circuits.
Claims6
A semiconductor integrated circuit device fabricated on a single semiconductor chip, comprising:
- a) a source of a multi-bit signal assigned a first area of said single semiconductor chip;
- b) a destination of said multi-bit signal assigned to a second area of said single semiconductor chip;
- and
- c) a plurality of signal wirings providing respective propagation paths between said source and said destination for component bits of said multi-bit signal,
- wherein said signal wirings include a first signal wiring and a second signal wiring,
- wherein said second signal wiring has a length shorter than a length of said first signal wiring,
- wherein said first signal wiring has a first width and is disposed a first distance away from a signal wiring adjacent to said first signal wiring,
- wherein said second signal wiring has a second width and is disposed a second distance away from a signal wiring adjacent to said second signal wiring, and
- wherein said first width is larger than said second width and said first distance is larger then said second distance such that a difference in a time constant due to the difference in length of said propagation paths is decreased.
6 more elements
A semiconductor memory device fabricated on a single semiconductor chip, comprising:
- a) an array of input signal pads where a multi-bit address signal is supplied from outside of said semiconductor memory device;
- b) an array of address buffer circuits for receiving said multi-bit address signal;
- and
- c) a plurality of signal wirings respectively connected between said input signal pads and said address buffer circuits to respectively provide propagation paths for component bits of said multi-bit address signal,
- wherein said plurality of said signal wirings are different in length,
- wherein the distance between each signal wiring and an adjacent signal wiring corresponds to the length of said each signal wiring and said adjacent signal wiring,
- wherein said plurality of signal wirings comprises at least a first group of signal wirings including a longest signal wiring and a second group of signal wirings including a shortest signal wiring,
- wherein all signal wirings of said first group of signal wirings have a first wiring width and all signal wirings of said second group of signal wirings have a second wiring width, and
- wherein said second wiring width is smaller than said first wiring width.
6 more elements
Dependencies are inferred from the claim text.