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US 5,473,191 AGranted
Hybrid integrated circuit device with apertured cover
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKatsunori Tanaka
Life of this patent
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Abstract
A hybrid integrated circuit device is constructed by injecting a protective resin 10 into a ring 9 enclosing functional elements 802-804 mounted on an integrated circuit board 8, and by providing a plate-like cover member 11 having variously shaped openings 12 overlying the resin.
Claims7
A hybrid integrated circuit device, comprising:
- a) an integrated circuit board (8),
- b) a plurality of electrical circuit components (802-804) individually mounted at least on one side of the board,
- c) an enclosing ring (9) disposed on said one side of the board and surrounding the circuit components,
- d) a protective resin (10) overlying the circuit components and filling a space defined by and within the ring up to an upper edge of the ring,
- e) means for preventing damage to the circuit components and electrical connections therebetween due to handling forces applied to an upper surface of the resin, said preventing means comprising a rigid, planar cover member fixed to said upper edge of the ring and overlying said upper surface of the resin, and
- f) means for relieving thermal stresses due to expansion and contraction of the resin, said relieving means comprising a plurality of open, uncovered apertures defined in and extending through the cover member to said upper surface of the resin.
3 more elements
Dependencies are inferred from the claim text.