Moisture-curable hot melt silicone pressure-sensitive adhesives

A moisture-curable silicone hot melt pressure-sensitive adhesive composition comprising:

• (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula --ZSiR.sup.1.sub.x (OR.sup.2).sub.3-x produced by the method comprising reacting (i) a hydroxyl functional organopolysiloxane resin comprising R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units, wherein the mole ratio of the R.sub.3 SiO.sub.1/2 siloxane units to SiO.sub.4/2 siloxane units has a value of from 0.5/1 to 1.2/1, and said hydroxyl content is 0.1 to 6 weight percent based on solids as determined by FTIR;
• with (ii) an alkoxy compound having the formula YSiR.sup.1.sub.x (OR.sup.2).sub.3-x ;
• wherein R is selected from the group consisting of hydrocarbon radicals and halogenated hydrocarbon radicals, R.sup.1 is a monovalent hydrocarbon radical, R.sup.2 is selected from the group consisting of a alkyl radical and alkoxyalkyl radical, Z is a divalent linking radical, Y is a radical which is reactive with the hydroxyl groups in the resin, and the subscript x has a value of 0 or 1;
• (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of hydroxyl radicals, alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals;
• said polymer having a viscosity at 25.degree. C. of 20 to 60,000 mm.sup.2 /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20;
• (C) sufficient catalyst to accelerate the cure of said composition;
• said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.