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US 5,472,585 AGranted
Regeneration of spent electroless copper plating solution
AssigneeAT&T Corp.
InventorsDonald Dinella, Sudarshan Lal, David A. Nicol
Life of this patent
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Abstract
Disclosed is a method for removal of contaminants and replenishment of an electroless copper plating solution in order to allow reuse of the solution. Copper oxide is dissolved in the spent solution and this is followed by an electrodialysis which removes formate and carbonate ions.
Claims10
A method for deposition of copper on an insulating substrate utilizing an electroless copper plating bath in a plating tank comprising the steps of:
- removing a portion of the bath from the plating tank;
- adding copper oxide to the portion of the bath in order to replenish copper used up during the plating;
- subsequently, transporting the portion of the bath to an electrodialysis apparatus to remove contaminants therefrom;
- and
- returning the portion of the bath to the plating tank.
2 more elements
Dependencies are inferred from the claim text.