Composite lead frame manufacturing method
OwnerAlexander H. C. Changinventor
Life of this patent
Estimating the term…
Abstract
A method for constructing a composite lead frame (10) wherein a plurality of lead segments (14) are separately constructed and then attached to a frame member (12). A plurality of the frame members (12) may optionally be produced as a lead frame strip (16). Each of the frame members (12) has an opposed pair of side rails (18) and a pair of cross members (20) for enclosing a lead area (22) wherein the lead segments (14) are affixed to the side rails (18) and the cross members (20) by a plurality of assembly tabs (40).
Claims20
A method for constructing a lead frame for use in the packaging of semiconductor devices, the lead frame comprising:
- constructing a frame member including an opposing pair of side rails and further including an opposing pair of cross members such that the side rails and the cross members enclose a generally rectangular lead area;
- constructing a plurality of lead segments, the lead segments including a plurality of leads at least substantially framed by a segment subframe;
- and
- affixing said lead segments to said frame member to form the lead frame, wherein;
- the segment subframes include a plurality of assembly tabs extending therefrom for attaching said lead segments to said frame member.
A method for constructing a lead frame, comprising:
- constructing a lead frame strip having at least one frame member with a generally rectangular lead area therein;
- separately constructing a plurality of lead segments, each of said lead segments having a plurality of leads, a segment subframe connecting all of the leads in that lead segment together such that each of said lead segments is a unitary body;
- and
- joining said plurality of lead segments to the frame member, within the lead area thereof, to form the lead frame, wherein;
- the segment subframe has protruding outwardly therefrom at least one joining tab;
- and
- the joining of said plurality of lead segments to the frame member is accomplished by connecting the joining tab to the frame member.
A method for constructing a lead frame for use in the packaging of semiconductor devices, the lead frame comprising:
- constructing a frame member including an opposing pair of side rails and further including an opposing pair of cross members such that the side rails and the cross members enclose a generally rectangular lead area;
- constructing a plurality of lead segments, the lead segments including a plurality of leads at least substantially framed by a segment subframe;
- and
- affixing said lead segments to said frame member to form the lead frame, wherein;
- the lead frame includes a plurality of assembly tabs for attaching said lead segments to said frame member.
Dependencies are inferred from the claim text.