Back to results
US 5,438,162 AGranted
Method and apparatus for isolating electronic boards from shock and thermal environments
AssigneeAlliedSignal Inc.
InventorsCraig Thompson, Lawrence L. Eakin
Life of this patent
Estimating the term…
Abstract
An apparatus for isolating electronic devices from mechanical shock and thermal environments utilizes a metal outer protective shell surrounding the electronic device to be protected. Interposed between the protective shell and the electronic device are a thermal insulating layer, a layer of phase change material and a layer of mechanical shock absorbent material.
Claims8
Apparatus for isolating an electronic device from mechanical shock and thermal environments, comprising:
- a layer of a rubber-like material surrounding said electronic device;
- a mass of preformed wax-like material having a high heat of fusion for absorbing a substantial quantity of heat before rising above a critical temperature limit in direct contact with and surrounding said rubber-like material;
- a heat insulating layer surrounding said mass of wax-like material;
- and
- a metal shell surrounding said heat insulating layer.
2 more elements
Apparatus for isolating a heat and mechanical shock sensitive device from heat and mechanical shock, comprising:
- a resilient shock-absorbent structure supporting said device;
- a heat sink formed by a preformed mass of material having high heat of fusion directly contacting and surrounding said device and shock-absorbent structure;
- and
- a heat insulating and physical penetration resistant shell surrounding said heat sink.
1 more element
Dependencies are inferred from the claim text.