Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied

A method for acquiring, holding, and releasing an article having a planar surface, comprising the steps of:

• providing a carrier that includes a planar surface covered by a resilient membrane, the planar surface including recessed regions into which the resilient membrane is sucked when a vacuum is applied to the recessed regions;
• bringing the planar surface of the article to be acquired into face-to-face contact with the resilient membrane;
• applying a vacuum to the recessed regions to suck the resilient membrane into the recessed regions leaving voids opposite the recessed regions between the resilient membrane and the article which function as suction cups to hold the article to the carrier;
• and,
• applying a pressurized fluid to the recessed regions to release the article from the carrier.

Apparatus for acquiring, holding, and releasing an object having an upwardly-facing planar surface, said apparatus comprising in combination:

• a carrier including a backing plate having a downwardly-facing generally-planar surface;
• a recessed region extending into the generally-planar surface of the backing plate;
• a resilient membrane covering the generally-planar surface of the backing plate;
• first means for bringing the upwardly-facing planar surface of the object into contact with said resilient membrane below said recessed region;
• second means for selectively applying a vacuum to said recessed region so as to draw said resilient membrane into said recessed region, producing a reduced pressure area between said resilient membrane and the upwardly-facing planar surface of the object, which reduced pressure area serves as a suction cup to retain the object;
• and,
• third means for selectively applying fluid under pressure to said recessed region to release the object.