US 5,400,219 AGranted

Tape automated bonding for electrically connecting semiconductor chips to substrates

AssigneeEastman Kodak Company

InventorsSamuel Reele, Thomas R. Pian

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Abstract

An article of manufacture which has a substrate including electrical leads and bond pads electrically connected to the leads. Two or more integrated circuit semiconductor chips are supported on the substrate. Each of the chips includes a plurality of edges and a plurality of input/output (I/O) bond pads. A portion of the bond pads on each chip are located adjacent at least one edge of the respective chip. At least two separate sections of Tape Automated Bonding (TAB) tape electrically connect the I/O bond pads on each chip to the bond pads on the substrate. In a refinement of the invention, the sections of TAB tape each include a plurality of inner lead bond leads extending from a longitudinal (along the tape length) edge of the tape. Each inner lead bond is connectable to one of the I/O bond pads on the chips. The inner lead bond leads are located a uniform distance apart from each other, this distance equalling the smallest distance apart between adjacent bond pads on any chip which the TAB tape is compatible with.

Claims8

Dependent claims

A method of forming an assembly of plural semiconductor chips to a substrate, comprising the steps of:

(a) providing a substrate which includes electrical leads and bond pads electrically connected to said leads and plural semiconductor chips mounted to said substrate, each chip including a plurality of edges and a plurality of input/output (I/O) bond pads located adjacent at least one of said edges;
and
(b) bonding a group of I/O bond pads located adjacent plural of said edges, which edges are essentially colinear with each other, on respective plural chips, to a first group of substrate bond pads with a first section of TAB tape
(c) severing portions of the TAB tape which include interconnection patterns not associated with said I/O bond pads bonded in said bonding step (b);
and (d) removing portions severed in step (c) to leave portions of said tape bonded to said bond pads located adjacent the colinear edges;
and wherein said edges of said chips that are generally colinear are directed in a first direction and wherein at least some of said chips include I/O bond pads located adjacent a second plurality of edges of chips, which edges are generally colinear with each other on respective plural chips and directed in a second direction perpendicular to the first direction and including the step of(e), subsequent to step (d), bonding a group of I/O bond pads located adjacent said second plurality of edges to a second group of substrate bond pads with a second section of TAB tape;
and, (f) severing portions of the second section of TAB tape;
and (g) removing portions severed in step (f) to leave portions of said second section of TAB tape bonded to bond pads located adjacent said second plurality of edges of chips.

5 more elements

Dependencies are inferred from the claim text.