Process of photopatterning a substrate with a positive photoresist composition containing a diazoquinone photosensitizer
AssigneeCiba-Geigy Corporation
InventorHans J. Merrem
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Abstract
Addition of compounds of formula I ##STR1## in which R.sup.1 to R.sup.4 are each hydroxyl or C.sub.1-6 -alkoxy and R.sup.5 to R.sup.10 are each hydrogen or C.sub.1-6 -alkyl, to positive photoresist compositions based on a diazoquinone/novolak resin effectively suppresses stray radiation and halation effects in corresponding photoresist coatings, in particular if these coatings have been applied to highly reflective substrates.
Claims4
A process of photopatterning a substrate comprising applying a positive photoresist composition layer thereto and imagewise exposing the layer to actinic radiation, wherein the photoresist composition comprises in admixture a diazoquinone photosensitizer, a novolak resin, and an amount effective to suppress stray radiation or halation effects in photoresist coatings made therewith, of a compound of the formula ##STR3## wherein R.sup.1 to R.sup.4 are each independently hydroxyl or C.sub.1 -C.sub.6 -alkoxy and
- R.sup.5 to R .sup.10 are each independently hydrogen or C.sub.1 -C.sub.6 -alkyl.
Dependencies are inferred from the claim text.