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US 5,399,460 AGranted
Negative photoresists containing aminoacrylate salts
AssigneeE. I. Du Pont de Nemours and Company
InventorsPaul E. Aldrich, Philip Manos, Allan E. Nader
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Abstract
Negative photoresists, and electronic devices comprising dielectric polyimide films resulting from such photoresists. The Photoresists comprise polyamic acids, which have been neutralized with tertiary amines containing double bonds of the acrylic family, the amines including acrylamines, alkylacrylamines such as for example methacrylamines, ethacrylamines, and the like. Also methods of making such amines in high purity.
Claims2
A negative photoresist comprising:
- (a) an aprotic N-methyl-2-pyrrolidone solvent;
- (b) a photosensitizing ingredient;
- and
- (c) a reaction product of (i) a polyamic acid derived from 3,3',4,4'-biphenyltetracarboxylic dianhydride and paraphenylene diamine and (ii) an N-methyldiethanolamine dimethacrylate tertiary amine, wherein the tertiary amine introduces from 10 to 200 ethylenic bonds per 100 carboxylic groups of the polyamic acid, with the proviso that a 13 to 17 micrometers thick film of the negative photoresist prepared by coating a silicon wafer with the photoresist composition, prebaking at 55.degree. C. for 120 minutes, patternwise exposing the coated wafer to actinic radiation and developing the patterned wafer to remove unexposed areas of the coating by immersion in a solution of N-methylpyrrolidone, methanol and water (13/7/1 weight ratio) for from 10 to 600 seconds, followed by a 15 second isopropanol rinse and air drying has the following properties:
- (i) an immersion development rate of at least 0.10 micrometers per second;
- (ii) a thickness retention of at least 70% after exposure at a dosage of 480 mJ/cm.sup.2, and
- (iii) a minimum pattern feature size of at most 20 micrometers.
4 more elements
A negative photoresist comprising:
- (a) an aprotic solvent;
- (b) a photosensitizing ingredient;
- and
- (c) a reaction product of a poly(amic acid) and a tertiary amine at least partially neutralizing the poly(amic acid), the tertiary amine having the formula ##STR10## wherein:
- R.sup.1d and R.sup.2d are independently alkyl containing 1 to 6 carbon atoms or cycloalkyl containing 3 to 6 carbon atoms;
- R.sup.3d is independently H or alkyl containing 1 or 2 carbon atoms;
- R.sup.4d is independently H or aryl;
- and
- m and n are independently integers of 1 to 6;
- wherein the tertiary amine introduces from 10 to 200 ethylenic bonds per 100 carboxylic groups of the poly(amic acid), with the proviso that a 13 to 17 micrometers thick film of the negative photoresist prepared by coating a silicon wafer with the photoresist composition, prebaking at 55.degree. C. for 120 minutes, patternwise exposing the coated wafer to actinic radiation and developing the patterned wafer to remove unexposed areas of the coating by immersion in a solution of N-methylpyrrolidone, methanol and water (13/7/1 weight ratio) for from 10 to 600 seconds, followed by a 15 second isopropanol rinse and air drying has the following properties:
- (i) an immersion development rate of at least 0.10 micrometers per second;
- (ii) a thickness retention of at least 70% after exposure at a dosage of 480 mJ/cm.sup.2 ;
- and
- (iii) a minimum pattern feature size of at most 20 micrometers.
11 more elements
Dependencies are inferred from the claim text.