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US 5,397,746 AGranted
Quad flat package heat slug composition
AssigneeIntel Corporation
InventorRichard C. Blish, II
Life of this patent
Estimating the term…
Abstract
An integrated circuit package which contains a heat slug that extends from an integrated circuit to a top surface of a surrounding housing. The heat slug has a coefficient of thermal expansion that matches the coefficients of thermal expansion of the housing and the integrated circuit to reduce thermal stresses in the package.
Claims2
A method of assembling a semiconductor package, comprising the steps of:
- a) coupling a lead frame to an integrated circuit;
- b) coupling a heat slug to said lead frame, said heat slug having a top surface and being constructed from a composition of 70% copper and 30% molybdenum;
- c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a plastic dielectric housing material;
- and,
- d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material.
2 more elements
A method of assembling a semiconductor package, comprising the steps of:
- a) coupling a lead frame to an integrated circuit;
- b) coupling a nickel heat slug to said lead frame, said heat slug having a top surface;
- c) encapsulating said integrated circuit, a portion of said lead frame and said heat slug to essentially said top surface of said heat slug with a dielectric plastic housing material;
- and,
- d) heating said plastic dielectric housing material, said heat slug, said lead frame and said integrated circuit to cure said plastic dielectric housing material. said plastic dielectric housing material.
2 more elements
Dependencies are inferred from the claim text.