Plating catalyst formed from noble metal ions and bromide ions
AssigneeShipley Company, L.L.C.
InventorsRoger F. Bernards, Gordon L. Fisher, Wade W. Sonnenberg
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Abstract
A process and catalyst for electroless plating of metal over a substrate. The process involves providing a catalyst that is the product of reaction of a noble metal with bromide ions where the ratio of bromide ions to noble metal ions is at least 100 to 1 and the noble metal is present in a concentration sufficient to catalyze an electroless plating reaction, contacting a substrate to be plated with the catalyst, and reducing the catalyst prior to or during plating of the substrate.
Claims20
A process for electroless plating of metal over a substrate, said process comprising the steps of providing an essentially tin-free catalyst formed by reacting noble metal ions with bromide ions where the noble metal is present in a concentration sufficient to catalyze an electroless plating reaction and a ratio of said bromide ions to said noble metal ions is at least 100 to 1;
- contacting a substrate to be plated with said catalyst;
- reducing said catalyst with a reducing agent and plating said substrate by contact of said reduced catalyst with an electroless metal plating solution.
A tin-free electroless plating catalyst formed by reacting noble metal ions with bromide ions where the noble metal ions are present in a concentration sufficient to catalyze an electroless plating reaction and a ratio of noble metal ions to bromide ions is at least 100 to 1.
Dependencies are inferred from the claim text.