Spin coating apparatus for film formation over substrate
AssigneeSony Corporation
InventorRikio Ikeda
Life of this patent
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Abstract
A method and apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate. A plate member is positioned at a predetermined height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate.
Claims25
A spin coating method for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the method comprising the steps of supporting the substrate, dropping the liquid material on the substrate, rotating the substrate about an axis extending through the center of the substrate and rotating a plate member in the same direction as the subtrate, said plate member being positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate.
A spin coating apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the apparatus comprising means for supporting the substrate and rotating the substrate about an axis extending through the center of the substrate, a nozzle for dropping the liquid material onto the substrate, a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate and means for rotating the plate member in the same direction as the substrate.
A spin coating method for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the method comprising the steps of supporting the substrate, dropping the liquid material on the substrate, rotating the substrate about an axis extending through the center of the substrate, and positioning a plate member at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, the plate member on a surface facing the substrate having a number of grooves for introduction of the fluid flows.
A spin coating apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the apparatus comprising means for supporting the substrate, means for dropping the liquid material on the substrate, means for rotating the substrate about an axis extending through the center of the substrate, and a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, the plate member an a surface facing the substrate being a number of grooves for introduction of the fluid flows.
A spin coating method for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the method comprising the steps of supporting the substrate, dropping the liquid material on the substrate, providing an atmosphere of a gas in which spin coating is to be performed, and rotating the substrate about an axis extending through the center of the substrate with a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, the gas having a kinematic viscosity coefficient .upsilon.1 defined as:
- .upsilon.1.gtoreq.r.sup.2.w/2.35.times.10.sup.-5
- where r is the radius of the substrate and w is the angular velocity of the substrate.
A spin coating apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the apparatus comprising means for supporting the substrate and rotating the substrate about an axis extending through the center of the substrate, a nozzle for dropping the liquid material onto the substrate, means including a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, a chamber for containing the substrate, means for charging the chamber with a gas.
A spin coating method for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the method comprising the steps of supporting the substrate, dropping the liquid material on the substrate, controlling the pressure of the atmosphere of the substrate to a value P, and rotating the substrate about an axis extending through the center of the substrate with a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, the pressure P being in the following range:
- P(mmHg).ltoreq.2.50.times.10.sup.3 .times.(1+0.00367t)/r.sup.2 w
- where r is the radius of the substrate and w is the angular velocity of the substrate.
A spin coating apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the apparatus comprising means for supporting the substrate and rotating the substrate about an axis extending through the center of the substrate, a nozzle for dropping the liquid material onto the substrate, means including a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, a chamber for containing the substrate, and means for decreasing the pressure in the chamber to a set value.
A spin coating method for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the method comprising the steps of supporting the substrate, dropping the liquid material on the substrate, controlling the temperature of the atmosphere of the substrate to a value t1, and rotating the substrate about an axis extending through the center of the substrate with a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, the temperature t1 being defined as:
- ##EQU32## where r is the radius of the substrate and w is the angular velocity of the substrate.
A spin coating apparatus for rotating a substrate having a liquid material placed thereon to coat the liquid material over the substrate, the apparatus comprising means for supporting the substrate and rotating the substrate about an axis extending through the center of the substrate, a nozzle for dropping the liquid material onto the substrate, means including a plate member positioned at a height above the substrate to minimize the growth of the fluid flows produced above the substrate due to rotation of the substrate, a chamber for containing the substrate, means for introducing a heated gas into the chamber to control the temperature of the chamber to a set value.
Dependencies are inferred from the claim text.