Process for depositing layers having high specific electrical conductivity
AssigneeSolvay Deutschland GmbH
InventorsAndreas Hamerich, Joerg Mueller, Guenther Doellein, Lars Lottermoser
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AssigneeSolvay Deutschland GmbH
InventorsAndreas Hamerich, Joerg Mueller, Guenther Doellein, Lars Lottermoser
Estimating the term…
A process for depositing metal-containing layers which have a high specific electrical conductivity, involving the decomposition of organometallic compounds in a hydrogen-containing gas or vapor phase by means of a plasma. The energy density of the plasma is optimized, which involves recording an OES spectrum. It is thus possible to produce, e.g., strongly adhering conductor tracks whose width is less than 50 .mu.m and whose ratio of height to width is greater than 1. Also disclosed are a method for optimizing the deposition of metal-containing layers having a high specific conductivity, and a composite body produced by the process of the invention comprising a polymer substrate and a metal layer deposited thereon.
A process for depositing a metal-containing layer having a high specific electrical conductivity onto a substrate, said process comprising the steps of:
A method for optimizing the deposition of metal-containing layers having a resistivity which is at most 200% of the electrical resistivity of the bulk material, involving the decomposition of an organometallic compound in hydrogen-containing gas or vapor phase by means of a plasma, conditions with regard to the energy density of the plasma being employed which can be determined as follows:
Dependencies are inferred from the claim text.