Method of sealing electrical connectors using a broad spectrum light and heat curable composition

A sealed connector including a molded plastic housing having a plurality of terminals therein, said terminals having portions that exit said housing at respective entrances to apertures along at least one face of said housing, and are exposed for electrical engagement with corresponding electrical conductive means said apertures commonly being slightly larger than said terminal portions extending therethrough defining gaps adjacent and surrounding said terminal portions and extending therealong into said housing from said face thereof, the connector being characterized in that:

• said gaps at least at said entrances are sealed with a sealant composition polymerized from a mixture comprised of:
• a major proportion of a vinyl polymerizable ester resin, said vinyl ester resin being selected from the group consisting of 2,2-bis[4-(2-hydroxy-3-acryloxypropoxy) phenyl] propane, 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy) phenyl] propane and acryloxy and methacryloxy urethane and being compatible with said housing plastic;
• a minor proportion of at least one modifying co-monomer comprising at least one polymerizable endgroup selected from the group consisting of acryloxy, methacryloxy, vinyl, and allyl, said co-monomer being compatible with said housing plastic and said resin;
• and
• from about 0.25 percent to about 5 percent by weight of the resin of a photosentizing system comprising at least one compound capable of activating the polymerization of said vinyl ester resin on exposure to radiation of actinic wavelengths, said sealant composition being sealingly adherent to and structurally reinforcing said housing and terminal portions and being solder- and solvent-resistant, and
• said mixture including a component material providing thixotropy to the resulting unpolymerized mixture enabling the mixture to fill said gaps,
• whereby said sealant composition adheres even to housings molded from thermoplastic glass-reinforced polyester or polyphenylene sulfide resins while remaining unaffected by elevated temperatures during soldering of said connector terminals to respective circuit means of a circuit element, said sealant composition thereby excluding solder and solvent from said gaps.

An electro-optical device including a plastic body portion including an exterior surface portion having gaps thereinto of macroscopic size, said body portion having said gaps thereof substantially filled and sealed with a sealant composition polymerized from a mixture comprised of:

• a major proportion of at least one vinyl ester resin comprising at least one polymerizable terminal endgroup selected from the group consisting of acryloxy and methacryloxy epoxy resins and acryloxy and methacryloxy urethane resins said vinyl ester resin being compatible with said plastic body portion;
• a minor proportion of at least one modifying co-monomer at least one polymerizable endgroup selected from the group consisting of acryloxy, methacryloxy, vinyl, and allyl, said co-monomer being compatible with said plastic body portion and said resin;
• and
• from about 0.25 percent to about 17 percent by weight of the resin of a polymerization activation system comprising at least one compound capable of activating the polymerization of said vinyl ester resin on exposure to radiation of actinic wavelengths, said sealant composition being sealingly adherent to and structurally reinforcing said body portion and being solder- and solvent-resistant;
• and
• said mixture including a component material providing thixotropy to the resulting unpolymerized mixture enabling the mixture to fill said gaps,
• whereby said sealant composition adheres even to body portions molded from thermoplastic glass-reinforced polyester and polyphenylene sulfide resins and solder and solvent are excluded from said gaps by said sealant material.