Boat transport for suporting semiconductor device assemblies

A boat transport in combination with a semiconductor device assembly having a package body including a surface and a plurality of pins that extend a selected distance in an array from the surface of the package body that has a thickness and a first dimension across the array of pins less than a second dimension across a peripheral portion of the package body, the boat transport comprising:

• a planar platform including a top surface for supporting thereon the peripheral portion of the package body of the semiconductor device assembly;
• a single cutout through the platform having two pairs of opposed sides for receiving within the cutout between the pairs of opposed sides the plurality of pins that extend in the array from the package body of the semiconductor device assembly;
• downward guides formed integrally with the platform as tabs on each of the opposite sides of the cutout and extending downward from the top surface of the platform in substantially planar alignment on each of the opposite sides and at a distance between downward guides on opposed sides of the cutout which is greater than the first dimension and less than the second dimension;
• and
• upward guides integrally formed with the platform as tabs near each of the opposed sides of the cutout extending upward from the top surface of the platform in substantially planar alignment near each of the opposed sides, and in plane parallel orientation with the downward guides on each of the corresponding opposed sides, and at a distance between upward guides on opposed sides of the cutout which is greater than the second dimension.