Laser direct writing

A method for providing a conductive metal deposit on a substrate having a surface, the method comprising the steps of:

• a) applying a composition to said surface of said substrate as a film or paste wherein said composition comprises
• (i) a compound consisting essentially of a copper or nickel compound and,
• (ii) an amine or amide compound having a nitrogen atom and at least one functional substituent group capable of coordination to and reduction of metal ions, said nitrogen atom and said functional substituent being separated by from two to six other atoms, or
• (iii) an intermediate reaction product of (i) and (ii);
• and
• b) subjecting that part of the applied composition where the deposit on the surface of the substrate is desired to a continuous wavelength laser beam of a wavelength from about 200 to about 1,000 nanometers and power of from about 5 to about 150 milliwatts at ambient conditions not employing an inert or reducing atmosphere and for a sufficient time to effect reductive deposition of copper or nickel, said film being thin enough or said paste being dispersed finely enough to allow unobstructed passage of said laser beam for absorption by the composition.