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US 5,353,364 AGranted
Optical module with improved grounding of an optical element
AssigneeSumitomo Electric Industries, Ltd.
InventorHiromi Kurashima
Life of this patent
Estimating the term…
Abstract
An optical functional element is contained in and grounded to a metal package. A grounding lead member, which is connected to a grounding lead pin forming portion via a connecting lead portion, is welded to the outer surface of the metal package either before or after resin molding.
Claims13
An optical module comprising:
- an optical connector for receiving an end of an optical fiber to be connected to the optical module;
- an optical functional element to be optically coupled with the optical fiber;
- a metal package fixed to the optical connector and containing the optical functional element, the optical functional element being grounded to the metal package;
- electronic circuit parts electrically connected to the optical functional element;
- a circuit board on which the electronic circuit parts are mounted;
- a plurality of lead pins electrically connected to the electronic circuit parts;
- at least one grounding member electrically connected to the metal package;
- a grounding lead pin electrically connected to the grounding lead member;
- and
- a resin mold member holding the metal package, electronic circuit parts, circuit board, lead pins, grounding member and grounding lead pin.
7 more elements
A manufacturing method of an optical module, comprising the steps of:
- preparing an assembly comprising a lead frame including a plurality of lead pin forming portions, at least one grounding lead member and a grounding lead pin forming portion electrically connected to the grounding lead member, a circuit board having electronic circuit parts and mounted on the lead frame, an optical connector supported by the lead frame, a metal package fixed to the optical connector and containing an optical functional element electrically connected to the electronic circuit parts and grounded to the metal package;
- electrically connecting the grounding lead member to the metal package;
- and
- molding the assembly with a resin to hold the metal package, electronic circuit parts, circuit board, lead pin forming portions, grounding lead member and grounding lead pin forming portion;
- and
- cutting out unnecessary portions of the lead frame.
3 more elements
A manufacturing method of an optical module, comprising the steps of:
- preparing an assembly comprising a lead frame including a plurality of lead pin forming portions, at least one grounding lead member and a grounding lead pin forming portion electrically connected to the grounding lead member, a circuit board having electronic circuit parts and mounted on the lead frame, an optical connector supported by the lead frame, a metal package fixed to the optical connector and containing an optical functional element electrically connected to the electronic circuit parts and grounded to the metal package;
- molding the assembly with a resin to hold the metal package, electronic circuit parts, circuit board, lead pin forming portions, grounding lead member and grounding lead pin forming portion;
- electrically connecting the grounding lead member to the metal package;
- and
- cutting out unnecessary portions of the lead frame.
2 more elements
Dependencies are inferred from the claim text.