Back to results
US 5,353,196 AGranted
Method of assembling electrical packaging structure and liquid crystal display device having the same
AssigneeCanon Kabushiki Kaisha
InventorMasanori Takahashi
Life of this patent
Estimating the term…
Abstract
A method of assembling an electrical packaging structure has a plurality of semiconductor chips arranged on a substrate and input wirings to the semiconductor chips connected thereto. The input wirings are distributed through a wiring board arranged on the substrate.
Claims1
A method for assembling an electrical circuit assembly comprising the steps of:
- preparing a substrate on which a plurality of output wirings and a plurality of input wirings exceeding the output wirings in number are formed;
- arranging a plurality of semiconductor chips on the substrate and connecting the chips to the input wirings;
- and
- arranging a wiring board for connecting the input wirings to the output wirings on the substrate.
1 more element
Dependencies are inferred from the claim text.