Microwave integrated circuit having a passive circuit substrate mounted on a semiconductor circuit substrate

A method of producing a microwave integrated circuit comprising:

• preparing a dielectric substrate having opposite first and second surfaces;
• forming a thin conductive film on the second surface of said dielectric substrate;
• forming passive circuit elements having respective terminals on the first surface of said dielectric substrate, the passive circuit elements including at least microstrip lines with said thin conductive film as a grounding conductor;
• forming openings penetrating through prescribed portions of said thin conductive film;
• forming through-hole conductors having respective first and second ends penetrating through portions of said thin conductive film so that the first end of each through-hole conductor protrudes from a corresponding opening of said thin conductive film and the second end is in contact with one of a terminal and a grounding conductor of said passive circuit element;
• preparing a semiconductor substrate having opposite first and second surfaces;
• depositing a thin conductive film on the second surface of said semiconductor substrate;
• forming active circuit elements having respective electrodes on the first surface of said semiconductor substrate;
• attaching a heat sink to the second surface of the semiconductor substrate;
• and
• mounting said dielectric substrate on said semiconductor substrate with the second surface of said dielectric substrate facing the first surface of said semiconductor substrate and electrically connecting said through-hole conductors to electrodes of said active circuit elements.

A microwave integrated circuit comprising:

• a passive circuit substrate comprising a thin dielectric film having opposite first and second surfaces, a thin conductive film disposed on the second surface of said thin dielectric film, passive circuit elements having respective terminals disposed on the first surface of said thin dielectric film, the passive circuit elements including at least coplanar transmission lines with said thin conductive film as a grounding conductor, openings penetrating through prescribed portions of said thin conductive film, and through-hole conductors having respective first and second ends and penetrating through portions of said thin conductive film, the first end of each through-hole conductor protruding from a corresponding opening of said thin conductive film and the second end contacting one of a terminal and a grounding conductor of a passive circuit element;
• and
• a semiconductor circuit substrate comprising a semiconductor substrate having opposite first and second surfaces, a thin conductive film disposed on the second surface of the semiconductor substrate, and active circuit elements having respective electrodes disposed on the first surface of the semiconductor substrate, wherein the passive circuit substrate is mounted on said semiconductor circuit substrate with the second surface of said passive circuit substrate facing the first surface of said semiconductor circuit substrate so that said though-hole conductors are electrically connected to electrodes of said active circuit elements.

A method of producing a microwave integrated circuit comprising:

• preparing a dielectric substrate having opposite first and second surfaces;
• forming a thin conductive film on the second surface of said dielectric substrate;
• forming passive circuit elements having respective terminals on the first surface of said dielectric substrate, the passive circuit elements including at least coplanar transmission lines with said thin conductive film as a grounding conductor;
• forming openings penetrating through prescribed portions of said thin conductive film;
• forming through-hole conductors having respective first and second ends penetrating through portions of said thin conductive film so that the first end of each through-hole conductor protrudes from a corresponding opening of said thin conductive film and the second end is in contact with one of a terminal and a grounding conductor of a passive circuit element;
• preparing a semiconductor substrate having opposite first and second surfaces;
• depositing a thin conductive film on the second surface of said semiconductor substrate;
• forming active circuit elements having respective electrodes on the first surface of said semiconductor substrate:
• attaching a heat sink to the second surface of said semiconductor substrate;
• and
• mounting said dielectric substrate on said semiconductor substrate with the second surface of said dielectric substrate facing the first surface of said semiconductor substrate and electrically connecting said through-hole conductors to electrodes of said active circuit elements.