Edge-mounted, surface-mount integrated circuit device

A circuit board assembly, comprising:

• a circuit board including a surface, an opening in said surface, and a plurality of conductors formed on said surface;
• an edge-mounted integrated circuit device mounted on said circuit board, said edge-mounted integrated circuit device including:
• a semiconductor die;
• a lead frame attached to said semiconductor die, said lead frame including a plurality of leads and at least one support, said leads electrically connected to said semiconductor die;
• a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from an edge of said package and bent to present a face surface-mount connected to an associated one of said conductors on said circuit board, said at least one support extending from said package and inserted into said opening in said circuit board to support said edge-mounted integrated circuit device.

A circuit board assembly, comprising:

• a circuit board including a surface and a plurality of conductors formed on said surface;
• an edge-mounted integrated circuit device mounted on said circuit board, said edge-mounted integrated circuit device including:
• a semiconductor die;
• a lead frame attached to said semiconductor die, said lead frame including a plurality of leads, a first support, and a second support, said leads electrically connected to said semiconductor die;
• a package encapsulating said semiconductor die and a portion of said lead frame, each of said leads extending from a first edge of said package and bent to present a face for surface-mount connection to an associated one of said conductors on said circuit board, each of said first and second supports extending from said package and bent to present a face contacting said surface of said circuit board to support said integrated circuit device, said first support and said second support being bent toward opposite sides of said package.